Thickness /
Property Analysis
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Equipment
XRR/XRF
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Model
MFM310
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Key Features
- Micro-XRF for thickness and composition analysis
- Micro-XRR for thin film thickness measurement
- Micro-XRD for crystallinity and orientation evaluation
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Equipment
Ellipsometric Measurement System
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Model
RE3500
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Key Features
- Spectroscopic Ellipsometer
- Single Wavelength Ellipsometer
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Spectroscopic Reflectometer
→ Measures optical constants and thickness of single/multi-layer films
→ High-speed measurement (1 sec) suitable for production monitoring
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Equipment
Film Stress & Wafer Bow Measurement
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Model
FSM128L
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Key Features
- Measures film stress (compressive/tensile) from 1×10⁷ to 4×10¹⁰ dynes/cm²
- Supports single and multiple scan lines for stress or wafer bow mapping
